Fiber base – enriched with synthetic fibers and vitamins that strengthen weak and brittle nails. The fibers create a strong, yet elastic structure that prevents breakage and bounce, ensuring a long-lasting manicure.
The base, enriched with vitamins E and B5, promotes healthy nail growth. Without HEMA and TPO – the formula reduces the risk of allergic reactions, making it suitable even for sensitive clients.
We do not recommend removing the sticky layer after hardening, as fibers may appear.
DESCRIPTION
Fiber base – enriched with synthetic fibers and vitamins that strengthen weak and brittle nails. The medium-thick consistency allows for precise and even distribution of the base and smoothing of the natural nail plate. The fibers create a strong, yet elastic structure that prevents breakage and bounce, ensuring a long-lasting manicure.
The base, enriched with vitamins E and B5, promotes healthy nail growth and helps prevent breakage. Without HEMA and TPO, the formula reduces the risk of allergic reactions, making it suitable even for sensitive clients.
USAGE
1. Degrease the nail plate with a dehydrator.
2. Apply a thin layer of acid-free primer (if the nail is oily, moist or the material tends to bounce).
3. Cover the nail plate with a thin layer of Stay (transparent) base for better adhesion. Polymerize.
4. Apply Fiber base. Polymerize.
5. Apply gel polish or Miracle top coat. Polymerize.
COMPOSITION
Our products are formulated without 15 harmful or potentially irritating ingredients commonly found in nail products. Find our product blacklist here:
HEMA (Hydroxyethyl Methacrylate)
TPO (Diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide)
Formaldehyde (Formaldehyde)
Methacrylic Acid (acids) except primer-acidic
Dibutyl Phthalate (DBP)
Formaldehyde resins (Formaldehyde Resin / Tosylamide/Formaldehyde Resin)
Triphenyl Phosphate (TPHP) (Triphenyl Phosphate)
Toluene (Toluene)
Xylene (Xylene)
Parabens (Parabens)
Ethyl Tosylamide (Ethyl Tosylamide)
Camphor
Phenoxyethanol (Phenoxyethanol)
Ethyl Methacrylate (EMA)
Carmine (Carmine / CI 75470)
